Dear Customers
Exhibiting at "FOOMA JAPAN 2019"
July 1, 2019
I Hope you are doing well. I would like to express my appreciation for your support of Komack.
It is our great pleasure to introduce newly developed products in the coming "FOOMA JAPAN 2019" that is starting on July 9 at the Tokyo Big Sight. We look forward to seeing you all and hope you will enjoy our show.
Sincerely,
1) Simple type filling and packaging machine "TJ-60"
It is small sized packaging machine that you can use on your desk.
This time, we will exhibit one that is installed tube pump for liquid, and thermal printer.
2) High-speed filling and packaging machine for powder/granule (Reference exhibition)
We will exhibit our concept machine for powder/granule, that can pack product with high speed and modifying sachet length.
We greatly improved its packaging capability than Conventional machines.
We accept the request of packaging capability test. If you need it, please come to our booth.
3) Underwater type leak tester "LT30-A, LT46-A"
We will exhibit the powder sachet leak tester for detecting pin-hole or wrong sealing.
We will display the leak tester for small sachet "LT-30A" and another for bigger sachet "LT46-A"
If you bring the your product sample, we will run with it right then.